RF360 - A Qualcomm-TDK joint venture

RF360 - A Qualcomm-TDK joint venture - We offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.

RF360 - A Qualcomm-TDK joint venture Featured kayayyakin

Amsa

Muna godiya ga haɗin kai da kayayyakin Chipsmall da kuma aikin. Ra'ayinka yana da muhimmanci a gare mu! Ka ɗauki lokaci ka gama aikin da ke ƙasa. Abin da ka faɗa yana tabbatar da cewa muna ba da hidima mai kyau da ka cancanci. Na gode don kasancewa cikin tafiyarmu zuwa mafi kyau.